6 Llayers 6mil Rigid Flex Multilayer PCB Board Immersion Silver
MultilayerPcb Board Shenzhen Circuit Board OEM PCB PCBA
Manufacturer Customized Circuit Board
Rigid-Flex Circuits and Assemblies
Ideal for hand-held to large devices, Rigid-Flex Circuits, and
Assemblies combine the benefits of flexible copper circuitry and
rigid PCB circuitry into a unitized power and signal solution for
superior reliability, system cost savings, and optimized packaging.
Leadsintec has spent years refining our engineering support,
equipment, and technology to better our rigid-flex PCB boards. We
have well-experienced technicians knowledgeable in state-of-the-art
technology to build your rigid-flex PCBs to customers' exact
specifications.
Rigid-Flex PCB Manufacturing Capability
| Items | Type | Normal Manufacturing Capability |
| Standard | Inspection Std. | IPC-6013 Class 2, IPC-A-600G Class 2, IPC-6013 Class 3 |
| Test Std. | IPC-TM-650,GB/T4677-2002 |
| Material | DuPont | AL9111R, AP9121R, AP9131R, AP8525R |
| Panasonic | R-F775 11RB-M, R-F775 22RB-M, R-F775 21RB-M |
| Taiflex | NDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THKD200520 |
| No Flow PP | VT-47N,VT-901 |
| CCL | ITEQ IT180A , ShengYi 1000-2,N4000-13, Rogers4350B,4003C |
| Process capacity | Layers | 2-20 |
| Thickness | 8-118mil |
| Max dimension | 15.74X28 Inch |
| Min precision Of Dim | ±4mil |
| Min diameter of holes | 4mil (Laser drill); 6mil(mechanical drill) |
| Aspect ratio | 16:1 |
Min trace width/space wtidth of outer | 3.0/3.0mil |
Min trace width/space wtidth of outer | 3.5/3.5mil |
| wtidth of outer layer(2OZ finished | 5/5mil |
Min trace width/space wtidth of inner | 3.5/3.5mil |
Min trace width/space wtidth of out layer(1OZ | 4/4mil |
| Min trace width/space wtidth of gridding circr | 5/5mil |
Min trace width/space wtidth of out layer(2OZ finishedcopper,Flex layer on top or bottom) | 5/5mil(1/3,1/2oz copper)；6.5/5mil(1oz copper)；8/5.5mil (2oz copper)； |
Min distance Between drilling&conductor(via holes) | 7mil(2layers);9mil(3~6Llayers);11mil(≥7layers) |
Min distance Between drilling&conductor(com ponent holes) | 10mil(2layers);12mil(3~6Llayers);14mil(≥7layers) |
Min distance Between drilling&conductor(burie d &blind holes) | 7mil |
Min ring of inner layer(via holes) | 5mil(≤6 Layers) ；8mil(＞8Layers) |
| Min ring of inner layer(component holes) | 8mil(≤6Layers) ；11mil(＞8 Layers) |
| coalescent location of rigid and flex | 1mm |
| HDI board | 1+n+1 |
| Surface treatment | Plating Gold(Hard gold) | Normal:0.25-0.76um;Hard gold:0.76-2um； |
| ENIG | Ni:3--8um,Au:0.05-0.1um |
| Immersion Tin | 0.80-1.20um |
| Immersion Silver | 0.10-0.30um |
| 0SP | 0.15-0.30um |
| HASL | 2-40um |
| HASL lead free | 2-40um |
| Silver ink | 10-25um |
| Selective surface finishing | ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion
sliver+gold finger; OSP +gold finger; Silver ink+Plating gold;
Silver ink+ENIG. |
| Routing | Outline Tol. | +/-4mil |
Quality Rigid-Flex Circuits
At Rigid-Flex Circuits Manufacturing, Leadsintec specialize in
bringing advanced rigid flex circuit designs to market, and we
consistently build on over 20 years of manufacturing expertise.
ISO9001, ISO13485, IATF16949 Certification. Our facilities offer
world-class, cost-effective PCB production and PCB Assembly. For
more information about what we can do for your PCB or PCBA project,
get in touch with our team today.
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Rigid Flex PCB Application Areas:
The characteristics of Rigid-flex PCB determine that its
application areas cover all application areas of FPC in PCB, such
as:
mobile phone
Button board and side buttons, etc.
Computer and LCD screen
Motherboard and display screen, etc.
CD Walkman
Disk Drive
NOTEBOOK.
Latest use
Hard disk drive (HDD, hard disk drive) suspension circuit (Su
ensi.N circuit) and xe package board, and other components.
