Halogen Free 2 Layer Pcb Board High Tg FR4 Fast PCB Assembly Immersion Gold

2 Layer High TG Medical PCB Assembly FR4 Circuit Flexible Rigid Bare Board SMT PCBA

PCB&PCBA Capacity:

1, Gerber files and BOM provided by the customer
2, Fine-pitch component and BGA placement
3, A good soldering workmanship and reliable quality
4, Flexible production capacity for high-mix model and low to medium order
5, Authorized components source, comprehensive supplier network support

Our capacity and service:

1. PCB fabrication from 1-32 layers. (single side, double side, multi-layer, HDI board, bury& blind holes board, etc)
2. Material procurement and management
3. Quick-turn PCBA Prototype and NPI (new product introduction)
4. PCBA and through-hole assembly
5. Complete Unit assembly (Box building includes the plastic, screen, metal enclosure, membrane, coils, wire harness, etc.)
6. Small volume is accepted and High-mix models solutions
7. AOI, In-circuit test, BGA placement, Function testing
8. Engineering support including end of life and obsolete component replacement and design support for circuit, metal, plastic casing, and packaging

Leadsintec Co., Ltd is an electronics manufacturing service (EMS) provider located in Shenzhen China since 2004. As an ISO 9001 certified electronics contract manufacturer, we offer a full range of PCB, component procurement, PCB assembly, box-build, testing, cables, and accessories services.

Owing to the past over 15 years of rich experience in manufacturing, Leadsintec has gained a fine reputation at home and abroad. Our products are mainly applied in the Consuming, Industrial, Automation, Automotive, Agriculture, Defense & Aerospace, Medical and Security markets.

Our commitment is to assist small and mid-sized customers in reducing their costs by providing total solutions, high-mixed, low, and medium volume services. With our skilled program managers, process engineers, production personnel, and procurement professionals, we are capable to fully understand and surpass your requirements.

Leadsintec’s manufacturing facilities include clean workshops and advanced high-speed SMT lines. Our chip placement precision can reach +0.1MM on integrated circuit parts. It means we can deal with almost all kinds of integrated circuits, such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA. Additionally, we can provide 0201 chip placement, through-hole component insertion, and finished product fabrication, test, and packing.