Sign In | Join Free | My himfr.com
Home > Automotive PCB Assembly >

2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed

Shenzhen Leadsintec Technology Co., Ltd
Contact Now
    Buy cheap 2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed from wholesalers
     
    Buy cheap 2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed from wholesalers
    • Buy cheap 2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed from wholesalers
    • Buy cheap 2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed from wholesalers
    • Buy cheap 2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed from wholesalers
    • Buy cheap 2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed from wholesalers

    2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed

    Ask Lasest Price
    Brand Name : Leadsintec
    Model Number : PCBA
    Certification : IATF16949, ISO13485, ISO9001
    Price : Negotiable (Depends on your gerber and bom)
    Payment Terms : L/C, T/T, D/A, D/P, Western Union
    Supply Ability : 80000pcs/month
    Delivery Time : 1-30days
    • Product Details
    • Company Profile

    2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed

    2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed


    Automotive PCB Assembly Contract Manufacturing 2 Layer Solder Mask Electronic PCBA


    What Can LeadsintecDo?

    Leadsintec is a professional PCB / PCBA Manufacturer in China, Shenzhen. With 20 years of development, FASPCBA turns into a first-class manufacturer of PCB / PCBA. From multi-layered to flexible printed circuit boards, Leadsintec is your one-stop-shop. We provide our customers with PCB Manufacturing, PCB Assembly, and Parts Sourcing services to save your time & cost.


    Flex PCB Capability :


    ItemsTypeNormal Manufacturing Capability
    Standard DeliverableInspection Std.IPC-6013 Class2, IPC-A-600G Class2
    Test Std.IPC-TM-650,GB/T4677-2002
    MaterialDuPontAL9111R, AP9121R, AP9131R, AP8525R
    PanasonicR-F775 11RB-M, R-F775 22RB-M, R-F775 21RB-M
    TaiflexNDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THK D200520JY
    Process capacityLayers0-14
    Thickness0.07-4.0mm
    Max dimension10X18 Inch
    Min precision Of Dim±4mil
    Min diameter of holes4mil (Laser drill); 8mil(mechanical drill)
    Aspect ratio10:1

    Min trace width/sp ce outer

    layer(0.5OZ )

    3.0/3.0mil

    Min trace width/space outer

    layer(1OZ )

    3.5/3.5mil

    Min trace width/space outer

    layer(2OZ )

    5/5mil

    Min trace width/space

    inner layer(0.5OZ )

    3.5/3.5mil

    Min trace width/space

    inner layer(1OZ )

    4/4mil

    Min trace width/space

    wtidth of gridding circr

    5/5mil

    Min trace width/space

    wtidth of out layer

    5/5mil(1/3,1/2oz copper);6.5/5mil(1oz copper);

    8/5.5mil(2oz copper);

    Min distance Between

    drilling&conductor(via holes)

    7mil(2layers);9mil(3~6Llayers);11mil(≥7layers)

    Min distance Between

    drilling&conductor(compon ent holes)

    10mil(2layers);12mil(3~6Llayers);14mil(≥7layers)

    Min distance Between

    drilling&conductor(buried

    &blind holes)

    7mil

    Min ring of inner layer(via

    holes)

    5mil(≤6 Layers) ;8mil(>8Layers)

    Min ring of inner

    layer(component holes)

    8mil(≤6Layers) ;11mil(>8Layers)
    The vias to the coalescent location of rigid and flex1mm
    HDI board1+n+1
    Surface treatmentPlating Gold(Hard gold)Normal:0.25-0.76um;Hard gold:0.76-2um;
    ENIGNi:3--8um,Au:0.05-0.1um
    Immersion Tin0.80-1.20um
    Immersion Silver0.10-0.30um
    0SP0.15-0.30um
    HASL2-40um
    HASL lead free2-40um
    Silver ink10-25um
    Selective surface finishingENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG.
    Min. bended radiussingle side flex3-6 times the flex thickness
    double sides flex6-10 times the flex thickness
    multi-layers flex10-15 times the flex thickness
    dynamic bending20-40 times the flex thickness

    Rigid-Flex PCB Capability :


    ItemsTypeNormal Manufacturing Capability
    StandardInspection Std.IPC-6013 Class 2, IPC-A-600G Class 2, IPC-6013 Class 3
    Test Std.IPC-TM-650,GB/T4677-2002
    MaterialDuPontAL9111R, AP9121R, AP9131R, AP8525R
    PanasonicR-F775 11RB-M, R-F775 22RB-M, R-F775 21RB-M
    TaiflexNDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THKD200520
    No Flow PPVT-47N,VT-901
    CCLITEQ IT180A , ShengYi 1000-2,N4000-13, Rogers4350B,4003C
    Process capacityLayers2-20
    Thickness8-118mil
    Max dimension15.74X28 Inch
    Min precision Of Dim±4mil
    Min diameter of holes4mil (Laser drill); 6mil(mechanical drill)
    Aspect ratio16:1

    Min trace width/space

    wtidth of outer


    3.0/3.0mil

    Min trace width/space

    wtidth of outer


    3.5/3.5mil

    wtidth of outer layer(2OZ finished5/5mil

    Min trace width/space

    wtidth of inner

    3.5/3.5mil

    Min trace width/space

    wtidth of out layer(1OZ

    4/4mil
    Min trace width/space wtidth of gridding circr5/5mil

    Min trace width/space

    wtidth of out layer(2OZ finishedcopper,Flex layer on top or bottom)

    5/5mil(1/3,1/2oz copper);6.5/5mil(1oz copper);8/5.5mil

    (2oz copper);

    Min distance Between

    drilling&conductor(via holes)

    7mil(2layers);9mil(3~6Llayers);11mil(≥7layers)

    Min distance Between

    drilling&conductor(com ponent holes)

    10mil(2layers);12mil(3~6Llayers);14mil(≥7layers)

    Min distance Between

    drilling&conductor(burie d &blind holes)

    7mil

    Min ring of inner

    layer(via holes)

    5mil(≤6 Layers) ;8mil(>8Layers)

    Min ring of inner layer(component holes)

    8mil(≤6Layers) ;11mil(>8Layers)

    coalescent location of rigid and flex

    1mm
    HDI board1+n+1
    Surface treatmen tPlating Gold(Hard gold)Normal:0.25-0.76um;Hard gold:0.76-2um;
    ENIGNi:3--8um,Au:0.05-0.1um
    Immersion Tin0.80-1.20um
    Immersion Silver0.10-0.30um
    0SP0.15-0.30um
    HASL2-40um
    HASL lead free2-40um
    Silver ink10-25um
    Selective surface finishing

    ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+

    GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG.

    RoutingOutline Tol.+/-4mil

    OEM Rigid Flexible Flex Pcb Board Circuit Assembly Pcba Services 0


    Leadsintec has been selected as the “excellent partner of the year” by numerous well-known enterprises, and won many domestic and authorized certifications at home and abroad, such as Chinese high-tech project certification, ISO9001, ISO14001, ISO13485, IATF16949 quality management system standard, and customized CE, UL, FCC, and other product certifications according to the customer's requirements.

    OEM Rigid Flexible Flex Pcb Board Circuit Assembly Pcba Services 2


    100% PCB PCBA Testing:


    OEM Rigid Flexible Flex Pcb Board Circuit Assembly Pcba Services 3


    Millions of circuit boards are produced here every year, which provides superior service for automotive electronics, medical electronics, power communications, industrial automation, military, aviation & aerospace, intelligent home, and other industries around the world. We will continue to improve our quality and service; customer satisfaction and the development of science and technology are our eternal motivation.

    Quality 2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Leadsintec Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)